Search Catalog
 All Categories    Wafer Planarization Machinery
View Cart View RFQs
 Shopping Cart 0 Items
 Request for Quote 0 Items
All Categories > Machinery > AMP Equipment > Wafer Planarization Machinery  

Wafer Planarization Machinery

Click on a Product to view details.

Item image

CMP Systems

  • 4” - 12” Wafer Diameter Capacity.
  • Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
  • Compact, space-efficient systems.
  • True CMP processing without a CMP system price.
  • Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
  • Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
  • Operator’s control touch-screen interface.
  • Menu-driven operations software.
  • Non-corrosive & low-expansion material construction.
  • Multi-Processing : Quick-change platen & polishing heads.