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All Categories > Machinery > AMP Equipment > Wafer Planarization Machinery  
 

Wafer Planarization Machinery

 

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CMP Systems

(2)
  • 4” - 12” Wafer Diameter Capacity.
  • Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
  • Compact, space-efficient systems.
  • True CMP processing without a CMP system price.
  • Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
  • Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
  • Operator’s control touch-screen interface.
  • Menu-driven operations software.
  • Non-corrosive & low-expansion material construction.
  • Multi-Processing : Quick-change platen & polishing heads.