CMP Systems On Lapmaster Wolters


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	CMP Systems
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	larger image		4” - 12” Wafer Diameter Capacity. Process up to two (2) wafers simultaneously or choose insitu pad conditioning. Compact, space-efficient systems. True CMP processing without a CMP system price. Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials. Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed. Operator’s control touch-screen interface. Menu-driven operations software. Non-corrosive & low-expansion material construction. Multi-Processing : Quick-change platen & polishing heads.