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Item # Model 712
Item # Model 712, CMP Systems
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4” - 12” Wafer Diameter Capacity.
Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
Compact, space-efficient systems.
True CMP processing without a CMP system price.
Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
Operator’s control touch-screen interface.
Menu-driven operations software.
Non-corrosive & low-expansion material construction.
Multi-Processing : Quick-change platen & polishing heads.
Specifications
System Features
No. of Work Station
2
Wafer Diameter
8 - 12
inches
Plate Diameter
27
inches
Plate Diameter
680
mm
Plate Speed
20 - 120
rpm
Down-Force Range
40 - 525
pounds
Oscillation Stroke
2.4
inches
Oscillation Stroke
0 - 60
mm
Oscillation Speed
0 - 10
strokes/m
Depth
51
inches
Height
90
inches
CNC Control
Standard
Variable Oscillation
Stroke & Speed
Three Independent Spindle Drive
Standard
A1203 Ceramic Platen
Standard
Quick-Change Platen
Standard
Quick-Change Heads
Standard
MORE IMAGES
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Platen and Polishing Heads