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Item # Model 612, CMP Systems
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- 4” - 12” Wafer Diameter Capacity.
- Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
- Compact, space-efficient systems.
- True CMP processing without a CMP system price.
- Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
- Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
- Operator’s control touch-screen interface.
- Menu-driven operations software.
- Non-corrosive & low-expansion material construction.
- Multi-Processing : Quick-change platen & polishing heads.
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