Item # Model 612, CMP Systems On Lapmaster Wolters


All Categories > Machinery > AMP Equipment > Wafer Planarization Machinery > CMP Systems > Item # Model 612

4” - 12” Wafer Diameter Capacity.
Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
Compact, space-efficient systems.
True CMP processing without a CMP system price.
Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
Operator’s control touch-screen interface.
Menu-driven operations software.
Non-corrosive & low-expansion material construction.
Multi-Processing : Quick-change platen & polishing heads.

Specifications

System Features

No. of Work Station		2

Wafer Diameter		4 - 8 inches

Plate Diameter		24 inches

Plate Diameter		620 mm

Plate Speed		20 - 120 rpm

Down-Force Range		20 - 250 pounds

Oscillation Stroke		2.4 inches

Oscillation Stroke		0 - 60 mm

Oscillation Speed		0 - 10 strokes/m

Depth		47 inches

Height		83 inches

CNC Control		Standard

Variable Oscillation		Stroke & Speed

Three Independent Spindle Drive		Standard

A1203 Ceramic Platen		Standard

Quick-Change Platen		Standard

Quick-Change Heads		Standard

Item # Model 612, CMP Systems