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All Categories > Machinery > AMP Equipment > Wafer Planarization Machinery > CMP Systems > View Items  

CMP Systems

 
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  • 4” - 12” Wafer Diameter Capacity.
  • Process up to two (2) wafers simultaneously or choose insitu pad conditioning.
  • Compact, space-efficient systems.
  • True CMP processing without a CMP system price.
  • Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials.
  • Fully programmable and independent kinematics for platen drive : Polishing head drives, polishing head pressure, polishing head oscillation & speed.
  • Operator’s control touch-screen interface.
  • Menu-driven operations software.
  • Non-corrosive & low-expansion material construction.
  • Multi-Processing : Quick-change platen & polishing heads.



  Results 1 - 2 of 2 1 

Item #

Item Name

Wafer Diameter

Plate Diameter

Plate Speed

Depth

Height
Model 612 CMP Systems 4 - 8 inches 24 inches 20 - 120 rpm 47 inches 83 inches
Model 712 CMP Systems 8 - 12 inches 27 inches 20 - 120 rpm 51 inches 90 inches
  Results 1 - 2 of 2 1 
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